Gigabyte Accidentally Lists Four TRX40 Motherboards for AMD Ryzen Threadripper 3000

Yesterday we reported on rumored prices for Asus’ upcoming AMD TRX40 motherboards, with the TRX40 chipset targeting AMD’s upcoming 3rd-generation Ryzen Threadripper CPUs. Today we bring you a new rumor: a list of Gigabyte’s upcoming TRX40 boards, as spotted by Computerbase. Sadly, we don’t have pricing for the boards this time around.

The info (PDF) comes from a compatibility listing for Gigabyte’s Aorus Gen4 AIC Adaptor and lists the following motherboards:

TRX40 Aorus Xtreme

TRX40 Aorus Master

TRX 40 Aorus Pro Wi-Fi

TRX40 Designare

Aorus is one of Gigabyte’s sub-brands targeting eSports and other PC gaming. But it also taps into other audiences, as shown by its Designare series.

There’s also a document (PDF) with details on PCIe support. As seen below, they all will apparently work at PCIe 4.0 speed, which doesn’t come as a surprise given that AMD’s mainstream X570 motherboards (for today’s generation of AMD CPUs) already do PCIe 4.0 too.

This leak follows an subtle reveal from just over a week ago, where Gigabyte South Africa’s Twitter revealed an image of what we suspect is one of its TRX40 boards (pictured below).

AMD’s upcoming TRX40 platform is said to debut in November and serve as AMD’s HEDT (high-end desktop) segment. It will launch alongside the Ryzen Threadripper 3000-series, which will pack up to 32 CPU cores.

Micron pumps out cheaper smaller NVMe SSD

Micron has broadened its data centre SSD range, moving the 9300 NVMe SSD technology down market, and adding a gumstick form factor. It has also replaced the 5200 SATA SSD with the 5300. The new lines all use the latest 96-layer TLC (3bits/cell) NAND.

The 7300 complements rather than replaces the 9300, according to Micro, which likens the 9300 to a Porsche GT3 and the 7300 to a Tesla Model 3.

Like the 9300 NVME SSD the 7300 comes in capacity-optimised PRO and endurance-optimised MAX versions. The PRO supports a single drive write per day and the MAX version lifts this to three DWPD.

The 7300 is hot-pluggable and supports Flex capacity. This means admins can tune the SSD to get the right capacity and endurance balance.

The 9300 comes in the U.2 form factor. Both the PRO and MAX 7300s are available in U.2 and lower capacity gumstick formats.

Their latencies are 90μs/25μs read/write; slower than 9300’s 86μs/11μs. Mean time to failure is two million hours and they have a five-year warranty. They use a PCIe Gen 3.1 x 4, 2×2 NVMe interface. 

The 7300 has half the maximum capacity of the 9300 PRO despite using denser 96-layer TLC NAND than the 9300’s 64-layer TLC. The 9300 PRO capacity reaches 15.36TB, the 7300 PRO has7.68TB, while the 7300 MAX’ 6.4TB is eclipsed by the 9300 MAX’s 12.8TB. You get less capacity for less money.

The 7300s will get a dual-port capability in the fourth quarter.

5300 line

The 5300 replaces the prior 5200. The 5200 SATA SSD line used 64-layer TLC NAND packaged into U.2 2.5-inch drives and came in Eco and Pro variants. There was also a 5210 ION using QLC flash. Micron’s 5300 drives use the denser 96 layer flash and are provided in Boot M.2 gumstick, Pro M.2 and U.2 formats, and a Max in U.2 form only. Micron has not pushed out a 5310 ION in QLC guise – perhaps one will come out in a few months..

All three 5300s use the SATA 6Gbit/s interface, have 3 million hours MTTF rating, like the 5200, and a five-year warranty. They support encryption, incorporate various data protection features and are hot-pluggable.

The Boot drive comes in a single 240GB capacity and is in the 1 drive write per day (DWPD) endurance category at 438 total terabytes written (TTBW).

The Pro is a capacity-optimised 1DWPD-class drive whereas the 5300 Max is an endurance-focused 3DWPD-class drive. The 5210s have random read latencies from 175μs to 200μs, and random writes in the 100μs to 650μs range.

The 5300 Pro extends its capacity up to 7.68GB, a big jump on the the 5200 Pro, which topped out at 1.92GB.

5300 speeds are approximately the same as the 5210s.

Micron thinks demand for SATA SSDs will continue for some time despite the growing popularity of faster NVMe SSDs. The latter are taking over from SAS drives. It also thinks that TLC and QLC flash products will co-exist, with QLC products expanding the market rather than replacing TLC flash.

SAMSUNG TEASES NEW EXYNOS CHIPSET, TO CROSS A “NEW FRONTIER” OF PERFORMANCE

We’re in the last months of 2019, and companies are starting to move their eyes to the next year. When it comes to chipset manufacturers, things shouldn’t be different. Qualcomm is expected to give details of its Snapdragon 865 in the next month, and MediaTek is already giving hints about its new range of midrange chipsets with 5G support. When it comes to Samsung, the company is a lot more busy, since it needs to build new smartphones and new Exynos chipsets for the 2020 season. Well, today the company is teasing a new Exynos chipset that probably will drive their upcoming flagship – Galaxy S11.

The company posted a teaser on Twitter, that as you may expect doesn’t reveal much. Instead, we can see the words “new frontier” and “cutting-edge processor” hinting that this is, in fact, a flagship SoC. Details about the technical specifications of Samsung’s upcoming Exynos chip are still scarce. However, we believe that they will come with a 5nm development process. After all, Samsung Foundry completed the development of 5nm EUV chips earlier this year. According to them, these new chips offer 25% better silicone density, 20% lower power consumption or 10% more power performance.

Rumors already indicate that the Galaxy S11 will ship with a 5nm chipset – The new Exynos or the new Snapdragon 865. Yeah, Qualcomm’s upcoming flagship SoC will also go for a 5nm process, since the giant chipmaker will be partnering with TSMC for the next Snapdragon. TSMC is ready for the 5nm process as well.

The Samsung Tech Day 2019 conference starts today, and a keynote is scheduled for a few hours from now. It’s a perfect opportunity to reveal a new Exynos chipset. Rumors are pointing to the arrival of Exynos 9630 – a mid-range chipset. However, if the new flagship SoC appears there, it won’t be a great surprise.

Arm Announces New Ethos-N57 and N37 NPUs, Mali-G57 Valhall GPU and Mali-D37 DPU

Today Arm is announcing four new products in its NPU, GPU and DPU portfolio. The company is branding its in-house machine learning processor IPs the Ethos line-up detailing more the existing N77 piece and also revealing the smaller N57 and N37 siblings in the family. To top things off, the company is also making ready its first mid-range GPU IP based on the brand-new Valhall architecture, the new Mali-G57. Finally, we’re seeing the release of a new mid-range DPU in the form of the Mali-D37.

Introducing the Ethos NPU Family

Arm’s NPU IP offering was first announced early last year, detailing its architecture a few months later, and has been publicly been known until known just as “Project Trillium”. Arm at TechCon this year has officially branded the IP as the Ethos line-up, and the N77 has been the main product that’s been previously referred to as the Trillium codename.

Microarchitecturally, the new branded Ethos-N77 now publicly changes its specs compared to what had been revealed last year by allowing for a configurable 1 to 4MB SRAM implementation, whilst last year it had been disclosed it would scale up to 1MB only. Arm explains that customers needed more memory bandwidth for processing these mesh networked NPUs, as DRAM bandwidth doesn’t scale up in the premium segment as fast as the core count does. The flagship IP offers up to 4TOPS processing power at 1GHz clock and has a respectable 5TOPS/W efficiency.

Arm is able to use the same building blocks across the different IPs. The NPUs all share the same MAC computation engine (MCE) and programmable layer engines (PLE). The MCE consists out of 128 MAC units, as disclosed last year, and is paired alongside a PLE. An MCE and PLE, plus SRAM, make up a computation engine (CE), and this is the scaling block that differs between the N77, N57 and N37, coming in 16x, 8x and 4x configurations in terms of the CE count.

The mid-range and low-end variants are being released a lot faster than other new IP technologies because Arm is seeing a lot more interest in doing ML in cost-constrained devices where every mm² of silicon is important. Particularly features like smartphone face unlocking or DTV resolution upscaling are becoming commodity features.

The new NPUs have already been licensed and delivered to customers.

Revealing the Mali-G57 – First Mid-range Valhall Based GPU

Earlier this year, Arm had announced the new Valhall architecture in the new Mali-G77 that we’re expecting to see in SoCs next year. The new GPU architecture is a more major departure from the Bifrost based GPUs we’ve seen over the last three years as Arm has completely revamped its graphics ISA and computation microarchitecture.

Today, Arm reveals that the company is adopting the new Valhall architecture in the mid-range, starting off with the new Mali-G57. We currently don’t have too many details on exactly what the finer microarchitecture configurations of the new GPU looks like, but we’re very likely looking at something that will be very similar to the G77, scaled down similar to how the G52 looked like compared to the G72.

Improvements compared to a G52 with three execution engines per core (3EE) promise 1.3x better performance in a similar core configuration, 30% better energy efficiency, and 30% better silicon density (due to the better performance).

Mali-D37 DPU – Bringing High-End Features To the Mid-Range

Finally, to wrap things up, Arm is now bringing to market a new mid-range DPU in the form of the Mali-D37.

The new IP is based on the “Komeda” architecture which was first introduced in the Mali-D71 and its follow-up, the Mali-D77 announced this year. Then new DPU targets resolutions of 2K and FHD and promises to take up only <1mm² on 16nm.

Intel Ghost Canyon NUC teardown reveals removable “The Element” module inside

Intel’s upcoming “Ghost Canyon” NUC is expected to be one of the most powerful mini computers from the company to date. Expected to be powered by a 45 watt, 9th-gen Intel Core H-series processor, the small form-factor computer will be aimed at gamers, and it includes a PCIe x16 slot for a discrete graphics card.

But it turns out the GPU isn’t the only thing that’s removable.

A teardown of a pre-production sample by a member of the Koolshare forum reveals that the heart of the computer is a removable module Intel currently refers to as “The Element,” which means you may be able to upgrade the CPU, memory, storage, and other components while keeping your existing case, power supply, and graphics card.

Intel hasn’t shared many details about the upcoming Ghost Canyon system yet, so the KoolShare post also reveals some interesting details including that:

The system measures 9.4″ x 8.5″ x 3.8″ making it small for a desktop, but large for an NUC.

It will be available wot Core i5-9300H, Core i7-9750H and Core i9-9980HK processor options

In addition to a cooling fan on The Element module, there are dual cooling fans on top of the system.

The computer has a 500 watt internal power supply.

There are two Thunderbolt 3 ports, six USB 3.1 Gen 2 Type-A ports, dual Gigabit Ethernet jacks, WiFi 6, Bluetooth 5, an SD card reader, an HDMI 2.0a port, a headset jack on the front, and a 3.5mm audio line out on the back.

According to an Intel spec sheet, the system supports up to three 4K displays if you’re using Intel UHD graphics alone. You may be able to connect additional displays if you add a discrete GPU.

Speaking of GPUs, the computer supports up to an 8″ long, double-width graphics card that uses up to 225 watts of power.

Other features include support for up to 32GB of DDR4-2666 memory, three M.2 slots with support for NVMe and/or Intel Optane memory, and a plastic case with a metal frame.

Intel will offer a 3-year warranty.

Last I’d heard, Intel was planning to bring the Ghost Canyon NUC to market early next year.

SK Hynix Develops 16 Gb DDR4 Chips for 32 GB Modules

SK Hynix announced on Monday that it has completed development of its first monolithic 16 Gb chip. This chip is to be made using its 3rd Generation 10 nm-class process technology. The new memory devices will enable the company and its partners to make more energy-efficient and higher capacity DIMMs, such as 32 GB unbuffered modules for consumers or higher capacity buffered modules for enterprise consumption.

SK Hynix’s 16 Gb chip made using the company’s 3rd Generation 10 nm-class manufacturing technology (also known as ‘1Z’ nm) and is rated for DDR4-3200 data transfer rates. The company states that these chips have a reduced power consumption by 40% when compared to modules of the same capacity based on 8 Gb DRAMs produced using the company’s 2nd Generation 10 nm-class (aka 1Ynm) process.

SK Hynix’s ‘1Z’ nm process technology uses a new substance that enables it to maximize capacitance and improve stability of DRAM devices compared to previous generation process technology. It remains to be seen whether or not usage of the new chemicals translate into additional benefits, such as clock range, or latency. Also, the new technology enables a 27% higher bits-per-wafer productivity, which will make new memory chips cheaper to produce. The manufacturer stresses that its ‘1Z’ nm process does not use extreme ultraviolet lithography (EUVL) and is still a fully DUV process.

In addition to its 16 Gb DDR4 chips, SK Hynix also introduced its 32 GB unbuffered DIMM and SO-DIMM modules that can be used by desktop computers. It is unclear when these modules are to be available, but it is logical to expect them to emerge after the 16 Gb DRAM devices hit mass production in 2020.

The company plans to use its 1Znm process technology to make a variety DRAM types, including commodity DDR4 memory, LPDDR5, and HBM3.

Grab this WD Black SN750 1TB SSD is at its lowest price ever

Amazon’s got a great cheap SSD deal on the WD Black series SSD just in time as the fall’s biggest titles start to take up precious storage on your PC storage.

You can pick up the WD Black SN750 1TB NVMe Internal Gaming SSD with heatsink right now for $179.99, the lowest it’s been all year, a $100 savings off the MSRP and $40 lower than the previous best.

Transfer speeds of 3,470 mbps make it a great choice if you’re looking to improve load times on games over an aging HDD. While excellent for gaming (faster load times), a good SSD is also perfect for tasks such as video editing when working with larger video files. Its custom heatsink allows for the SN750 for longer, sustained peak performance which is always a plus.

Take a look and see how it compares to the best NVMe SDDs of this year.

If you’re unsure or just weighing your options, make sure you bookmark our Black Friday SSD deals page where we will be combing all the major online retailers for the best deals we can find leading up to Black Friday.

Jorge Jimenez is a Hardware Writer from the enchanted lands of New Jersey. When he’s not filling the office with the smell of Pop-Tarts, you can find Jorge streaming bad games with his dog or binge-watching an irresponsible amount of Law & Order: SVU.

GA-PICO3350 is Gigabyte’s smallest motherboard to date (embedded CPU + RAM and storage slots)

Measuring just about 3.9″ x 2.8″, the new Gigabyte GA-PICO3350 motherboard is just a little larger than a Raspberry Pi Model B (3.4″ x 2.2″). But while the Raspberry Pi features an ARM-based processor and embedded memory, Gigabyte’s tiny board has a DDR3L SODIMM slot for laptop-type memory plus an mSATA/mini PCIe slot for storage.

That said, while you could theoretically use Gigabyte’s tiny new Pico ITX board for just about any computing task, its embedded 6 watt Intel Celeron N3350 dual-core “Apollo Lake” processor isn’t exactly a speed demon.

So I suspect this is the type of board that will appeal more to IoT developers than to home users. Still, it’s kind of nifty… mostly because it’s just so small.

In addition to the specs listed above, the board has the following features:

2 x USB 3.0

Gigabit Ethernet

HDMI 1.4a

SATA 6Gb/s connector + SATA power connector

USB 2.0, Serial port, GPIO, LVDS, and SMBus headers

Gigabyte says the system supports Windows 10 64-bit software as well as Linux (although the company suggests downloading “Linux driver from chipset vendors’ website or 3rd party website.”

There’s no word on the price for the GA-PICO3350, but the similarly-=sized MSI MS-98I6 sells for around $300 — although that model supports faster memory and features dual display outputs and dual Ethernet jacks, among other differences.

MSI’s pico-ITX board is also slightly larger, at 101mm x 73mm compared to 100mm x 72mm for the Gigabyte model.

AMD 2nd Gen EPYC Rome Processors Feature A Gargantuan 39.54 Billion Transistors, IO Die Pictured in Detail

The AMD 2nd Generation EPYC Rome processors launched in August & since then, we have been getting more details about the chip itself along with its features. The latest details for the I/O die which include close-up die shots have been revealed by Hardwareluxx, giving us a better look at AMD’s most innovative server chip to date.

AMD 2nd Gen EPYC Rome Processor IOD Detailed – 8.34 Billion Transistors on a Single Die, 39.54 Billion on The Entire Chip

There have been many details that AMD has just recently started revealing for their 2nd Gen EPYC Rome processors. The AMD EPYC Rome processors are composed of a 9 die design which is also to be referred to as MCM (Multi-Chip-Module). The 9 dies include eight CCD’s (Compute Core dies) & a single IOD (Input / Output die). Each CCD is composed of two CCX (Compute Core complexes) that feature four Zen 2 cores with their own respective L2 cache and a shared L3 cache. All eight CCD’s are connected to the I/O die using infinity fabric.

Each CCD measures 74mm2 and is composed of 3.9 Billion transistors. The IOD featured on Ryzen has a die size of 125mm2 and is composed of 2.09 Billion transistors. The IOD featured on EPYC is composed of 8.34 Billion transistors and measures at 416mm2. It’s the biggest die on the 2nd Gen EPYC chip. The IOD combined with the 8 Zen 2 CCD’s measure at 1008mm2 while being composed of a whooping 39.54 Billion transistors.

Now the IOD featured on the one is much bigger than the one featured on the Ryzen processors. This is due to the more demanding feature set of the server platforms. When exposed through the use of transillumination, the IO die is clearly exposed and the internal blocks can be revealed much clearly.

It is stated that much of the central space on the IOD is dedicated to the SRAM and crossbar switch while the PCIe Gen 4 interfaces can be found on the sides of the IOD. The upper and lower areas of the die feature the four 72-bit DDR4 memory channels. Now here’s the interesting part, EPYC 2nd Gen has the ability to scale up to 162 PCIe lanes by offering twice the bandwidth through PCIe Gen 4 and reducing the Infinity Fabric’s reliance on the bus to expose more lanes on custom processors that are planned for launch later. The extra PCIe lanes are already there but they are being used by the interconnect.

In addition to the IOD, the Zen 2 CCD or Compute Core Die have also received their own die shots from OC_Burner at Flickr. For those who haven’t seen them before, the following is what each core die of your Ryzen processor looks like. The same die is being used across Zen 2 based Ryzen, EPYC and the upcoming Ryzen Threadripper processors:

Also, the IOD for EPYC processor is compared to the IOD on Ryzen processors revealing just how big of a chip the server-aimed IOD is. AMD already briefed on how they will be configuring various 2nd Gen EPYC Rome processors based on different core counts. While all EPYC Rome chips have a total of 8 CCD’s, not all of them would be enabled on many processors.

Even some CCD’s have to be partially disabled such as the 16 core model. The 16 core model has only four CCD’s enabled & each CCD is partially enabled with only four cores which means there are only 2 cores enabled on each CCX. Some CCD’s have three cores enabled per CCX while others such as the 48 core variant have all 8 CCD’s enabled but two of the CCD’s have a CCX with all four cores enabled and the other with a just three cores enabled.

But this is just the start, AMD is expected to use more advanced packaging and chiplet designs in their next-generation server processors codenamed EPYC Milan and EPYC Genoa which would use the Zen 3 and Zen 4 core architecture, respectively. If everything runs smoothly for AMD and their long-term Zen roadmap in the years to come, we can see them dominating all sectors of the CPU market again. AMD’s EPYC Rome has already secured major deals with Amazon (AWS) and will also be providing 7nm Rome processors to power the Atos BullSequana XH2000 Supercomputer while a future-generation EPYC line would be powering the Frontier Supercomputer that is being built by U.S. Department of Energy and aiming deployment in 2021.

AMD Ryzen 7 3750X with 105 W TDP: Spotted at AMD

AMD has accidentally published its Product Master list – a list with all of its consumer, enterprise, and OEM parts listed. In the latest publication, it reveals multiple CPUs that could potentially be released in the future. The document, which is dated September 2019, indicates that AMD may be mulling to launch its Ryzen 7 3750X product with a 105 W TDP, though does not disclose its specifications or if it is OEM-only.

As the product number suggests, AMD’s Ryzen 7 3750X will sit between the eight-core Ryzen 7 3800X and the eight-core Ryzen 7 3700X, which leads to a suggestion that we are dealing with another eight-core CPU with SMT. Meanwhile, the base frequency difference between the Ryzen 7 3700X and 3800X is only 300 MHz, which is pretty narrow, whereas the former features a mainstream TDP of 65 W, while the latter can go all the way to 105W.

Keeping in mind that AMD already has a rather diverse Ryzen 3000 (aka Matisse) family and the fact that the company may have various ideas how to improve its product lineup, it is not particularly easy to make predictions about future products, especially if they may end up as OEM-only products, inside desktops of only one or two partners. The only thing that is certain at this point is that AMD might be considering to strengthen its desktop family if it feels necessary.

AMD’s Product Master document seems to be aimed at the company’s sales teams and contains OPN codes along with US ECCN, HTS, and CCATS codes that are required by the US export regulators. While the list mentions numerous products, at least some of them are potential or partner-specific products.